THERMAL DIFFUSION PLATE FOR PORTABLE ELECTRONIC APPARATUS

• Main Authors: AHAMED MOHAMMAD SHAHED, SAITO YUJI
• Format: Patent
• Language: English; Japanese
• Published: 04.11.2016
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a thermal diffusion plate capable of suppressing temperature increase of a heat generating body such as an electronic element and capable of promoting thinning of a portable electronic apparatus.SOLUTION: The thermal diffusion plate for a portable electronic apparatus is so configured that a heat pipe 3 is mounted along a metal plate 2 with which a heat generating body 5 is brought into contact, and heat of a heating region 4 with which the heat generating body 5 of the metal plate 2 is brought into contact is transmitted to a place apart from the heating region 4 of the metal plate 2 with the heat pipe 3. The heat pipes include a first heat pipe 3a of a predetermined length and a second heat pipe 3b of a length longer than the length of the first heat pipe 3a. A part of the first heat pipe 3a is disposed in the heating region 4.SELECTED DRAWING: Figure 1 【課題】電子素子などの発熱体の温度上昇を抑制でき、しかも携帯型電子機器の薄型化を促進することのできる熱拡散板を提供する。【解決手段】発熱体５が密着させられる金属板２にヒートパイプ３が添わせて取り付けられ、金属板２の発熱体５が密着させられている加熱領域４の熱をヒートパイプ３によって金属板２の加熱領域４から離れた箇所に伝達する携帯型電子機器用熱拡散板であって、ヒートパイプは、所定の長さの第１ヒートパイプ３ａと、第１ヒートパイプ３ａより長い第２ヒートパイプ３ｂとを含み、第１ヒートパイプ３ａの一部が加熱領域４に配置されている。【選択図】図１