POLYAMIDE MOLDING MATERIAL, USE OF THE SAME, AND MOLDED ARTICLE PRODUCED FROM THE SAME

• Main Authors: PHILIPP HARDER, HERBERT MOSSAUER
• Format: Patent
• Language: English; Japanese
• Published: 27.10.2016
• Subjects: AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

PROBLEM TO BE SOLVED: To provide a polyamide molding material that gives a molded article having high surface quality and a low warp in injection molding and is suitable to produce a housing or housing parts of an electric/electronic appliance.SOLUTION: A polyamide molding material contains at least one partial crystalline and partial aromatic polyamide (A) and at least one amorphous polyamide (B), wherein the polyamides (A) and (B) comprise 30-60 wt.% of the polyamide molding material. The polyamide molding material further contains 40-70 wt.% of glass fiber (C) having a flat cross section, 0-15 wt.% of at least one halogen-free flame retardant (D), and 0-10 wt.% of another additive (E). The sum of the components (A) to (E) is 100 wt.% of the polyamide molding material. The at least one partial crystalline and partial aromatic polyamide (A) has a glass transition temperature of at lowest 105°C.SELECTED DRAWING: Figure 3 【課題】射出成形した際に、良好な表面品質を有し、低い反りを示す成形品をもたらし、さらに、電気・電子機器のハウジングまたはハウジング部品の製造に適当なポリアミド成形材料の提供。【解決手段】少なくとも一つの部分結晶性、部分芳香族ポリアミド（Ａ）と少なくとも一つの非晶質ポリアミド（Ｂ）を含有するポリアミド成形材料。ポリアミド（Ａ）および（Ｂ）は、ポリアミド成形材料の３０〜６０重量％を共に構成し、更に、ポリアミド成形材料は、４０〜７０重量％の、平坦横断面を有するガラス繊維（Ｃ）、０〜１５重量％の、少なくとも１つのハロゲン不含難燃剤（Ｄ）、及び０〜１０重量％の更なる添加剤（Ｅ）を含有し、成分（Ａ）から（Ｅ）は合計で、該ポリアミド成形材料の１００重量％を構成し、少なくとも一つの部分結晶性、部分芳香族ポリアミド（Ａ）は、少なくとも１０５℃のガラス転移温度を有するポリアミド成形材料。【選択図】図３