GRINDING DEVICE

• Main Author: FUKUHARA KEISUKE
• Format: Patent
• Language: English; Japanese
• Published: 20.10.2016
• Subjects: BASIC ELECTRIC ELEMENTS; DRESSING OR CONDITIONING OF ABRADING SURFACES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; PERFORMING OPERATIONS; POLISHING; SEMICONDUCTOR DEVICES; TRANSPORTING

PROBLEM TO BE SOLVED: To provide a grinding device which can shorten the grinding time by reducing the amount of movement of a grindstone for grinding a work-piece.SOLUTION: A sensor 15 is moved on the work-piece surface of a portion (Wb) on one side which is located opposite, across a rotation axis O of a work-piece W, to a portion (Wa) of the work-piece W facing a grindstone 12. The sensor 15 is moved from a work-piece outer periphery position P1 to a position P2 just before the rotation axis O where there is no interference with the grindstone 12. Then, the present invention predicts a surface shape from the position P2 just before the rotation axis O of the rest of the work-piece W to the rotation axis O. In this way, a main control unit 21 controls tilt adjustment by a tilt mechanism 14.SELECTED DRAWING: Figure 1 【課題】ワークを研削する砥石の移動量を減らして研削加工処理時間の短縮を可能にする研削加工装置を提供する。【解決手段】砥石１２に対向するワークＷの一部(Ｗａ)とワークＷの回転軸線Ｏを挟んで反対側に位置する片側の部分(Ｗｂ)のワーク表面上を、ワーク外周位置Ｐ１から、砥石１２と干渉しない回転軸線Ｏ手前の位置Ｐ２までセンサ１５を移動させて、残りのワークＷの回転軸線Ｏの手前の位置Ｐ２から回転軸線Ｏの位置までの表面形状を予測して、チルト機構１４によるチルト調整を制御する主制御部２１を備える。【選択図】図１