CONDUCTIVE ADHESIVE, CONDUCTIVE ADHESIVE SHEET AND ELECTROMAGNETIC WAVE SHIELDING SHEET
PROBLEM TO BE SOLVED: To provide a conductive adhesive which can form a conductive adhesive sheet having high adhesiveness on a plated surface and high heat resistance and also having excellent connection reliability, and provide a conductive adhesive sheet and an electromagnetic wave shielding shee...
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Main Authors | , , , |
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Format | Patent |
Language | English Japanese |
Published |
20.10.2016
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Subjects | |
Online Access | Get full text |
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Summary: | PROBLEM TO BE SOLVED: To provide a conductive adhesive which can form a conductive adhesive sheet having high adhesiveness on a plated surface and high heat resistance and also having excellent connection reliability, and provide a conductive adhesive sheet and an electromagnetic wave shielding sheet.SOLUTION: An conductive adhesive comprises a thermosetting resin, a curing agent, conductive fine particles, and heterocyclic amine, where the heterocyclic amine has a 5 membered or 6 membered heterocycle, and the curing agent has at least one curing agent (X) selected from the group consisting of isocyanate compound, aziridine compound, and metal chelate compound.SELECTED DRAWING: Figure 1
【課題】本発明は、メッキ面に対する高い接着性と高度な耐熱性を有し、接続信頼性に優れた導電性接着シートを形成できる導電性接着剤、導電接着シートおよび電磁波シールドシートの提供を目的とする。【解決手段】熱硬化性樹脂と、硬化剤と、導電性微粒子と、複素環アミンとを含み、 前記複素環アミンが、5員環または6員環の複素環を有し、前記硬化剤が、イソシアネート化合物、アジリジン化合物、および金属キレート化合物からなる群より選ばれる少なくとも1つの硬化剤(X)を含有する、導電性接着剤により解決される。【選択図】図1 |
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Bibliography: | Application Number: JP20160059558 |