SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a semiconductor device with the smaller area, the higher integration, and the larger storage.SOLUTION: The semiconductor device includes a first transistor, an insulating layer on the first transistor, a second transistor on the insulating layer, a first wire, a seco...

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Bibliographic Details
Main Author KAWAE DAISUKE
Format Patent
LanguageEnglish
Japanese
Published 13.10.2016
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Summary:PROBLEM TO BE SOLVED: To provide a semiconductor device with the smaller area, the higher integration, and the larger storage.SOLUTION: The semiconductor device includes a first transistor, an insulating layer on the first transistor, a second transistor on the insulating layer, a first wire, a second wire, a third wire, and a conductive layer. A gate of the first transistor is electrically connected to the conductive layer. One of a source electrode and a drain electrode of the first transistor is electrically connected to the first wire. The other of the source electrode and the drain electrode of the first transistor is electrically connected to the second wire. A gate of the second transistor is electrically connected to the third wire. One of a source electrode and a drain electrode of the second transistor is electrically connected to the conductive layer. The other of the source electrode and the drain electrode of the second transistor is electrically connected to the second wire. A top surface of the insulating layer, a top surface of the conductive layer, a top surface of the source electrode of the first transistor, and a top surface of the drain electrode of the first transistor are flat.SELECTED DRAWING: Figure 4 【課題】専有面積が小さく、高集積化、大記憶容量化が可能な半導体装置を提供する。【解決手段】第1のトランジスタと、前記第1のトランジスタ上の絶縁層と、前記絶縁層上の第2のトランジスタと、第1の配線と、第2の配線と、第3の配線と、導電層と、を有し、第1のトランジスタのゲートは、前記導電層と電気的に接続され、第1のトランジスタのソース電極又はドレイン電極の一方は、前記第1の配線と電気的に接続され、第1のトランジスタのソース電極又はドレイン電極の他方は、第2の配線と電気的に接続され、第2のトランジスタのゲートは、第3の配線と電気的に接続され、第2のトランジスタのソース電極又はドレイン電極の一方は、導電層と電気的に接続され、第2のトランジスタのソース電極又はドレイン電極の他方は、第2の配線と電気的に接続され、絶縁層の上面、導電層の上面、第1のトランジスタのソース電極の上面及び第1のトランジスタのドレイン電極の上面は、平坦である半導体装置。【選択図】図4
Bibliography:Application Number: JP20160097811