WAFER TRANSFER DEVICE

• Main Author: INADA TOMOHIRO
• Format: Patent
• Language: English; Japanese
• Published: 06.10.2016
• Subjects: AIR-CONDITIONING, AIR-HUMIDIFICATION, VENTILATION, USE OF AIRCURRENTS FOR SCREENING; BASIC ELECTRIC ELEMENTS; BLASTING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; HEATING; LIGHTING; MECHANICAL ENGINEERING; RANGES; SEMICONDUCTOR DEVICES; VENTILATING; WEAPONS

PROBLEM TO BE SOLVED: To provide a wafer transfer device capable of removing the dust, adhering to the front surface and/or back surface of the sample, in transfer process of the sample.SOLUTION: In a wafer transfer device including an arm (104) for transferring a wafer (4) of transfer object, and a...