WAFER TRANSFER DEVICE

PROBLEM TO BE SOLVED: To provide a wafer transfer device capable of removing the dust, adhering to the front surface and/or back surface of the sample, in transfer process of the sample.SOLUTION: In a wafer transfer device including an arm (104) for transferring a wafer (4) of transfer object, and a...

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Bibliographic Details
Main Author INADA TOMOHIRO
Format Patent
LanguageEnglish
Japanese
Published 06.10.2016
Subjects
AIR-CONDITIONING, AIR-HUMIDIFICATION, VENTILATION, USE OF AIRCURRENTS FOR SCREENING
BASIC ELECTRIC ELEMENTS
BLASTING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
HEATING
LIGHTING
MECHANICAL ENGINEERING
RANGES
SEMICONDUCTOR DEVICES
VENTILATING
WEAPONS
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Summary:PROBLEM TO BE SOLVED: To provide a wafer transfer device capable of removing the dust, adhering to the front surface and/or back surface of the sample, in transfer process of the sample.SOLUTION: In a wafer transfer device including an arm (104) for transferring a wafer (4) of transfer object, and a drive mechanism for moving the arm, a vibrator (1) for propagating a vibration to the movement trajectory of the wafer moving by the driving of the drive mechanism is provided. According to the invention, dust adhering to the wafer can be removed during transfer of the wafer.SELECTED DRAWING: Figure 2 【課題】本発明は、試料表面、裏面、或いはその両面に付着した塵埃を試料の搬送過程で除去することが可能なウェーハ搬送装置の提供を目的とする。【解決手段】上記目的を達成するために本発明では、搬送対象であるウェーハ（４）を搬送するアーム（１０４）と、当該アームを移動させる駆動機構を備えたウェーハ搬送装置であって、前記駆動機構の駆動によって移動する前記ウェーハの移動軌道に対して、振動を伝播させる振動子（１）を備えたウェーハ搬送装置を提案する。本発明によれば、ウェーハに付着した塵埃を、ウェーハ搬送中に除去することが可能となる。【選択図】図２
Bibliography:Application Number: JP20150058912