DAMPING STRUCTURE AND DAMPING COMPONENT

PROBLEM TO BE SOLVED: To provide a damping structure with high vibration reduction effect capable of sufficiently reducing vibration to be transmitted to a vibrated body.SOLUTION: A damping frame 10 has a damping clip 4 and a frame 6. The damping clip 4 compresses and holds damping materials 1a, 1b...

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Main Authors KASAMA HIROKI, TAKAHATA KAZUAKI, ENDO RIE, SHIBATA KAZUMASA, YOKOYAMA KATSUNORI, YAMAMOTO MASAMICHI
Format Patent
LanguageEnglish
Japanese
Published 06.10.2016
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Summary:PROBLEM TO BE SOLVED: To provide a damping structure with high vibration reduction effect capable of sufficiently reducing vibration to be transmitted to a vibrated body.SOLUTION: A damping frame 10 has a damping clip 4 and a frame 6. The damping clip 4 compresses and holds damping materials 1a, 1b with respect to the frame 6 by pressing the damping materials 1a, 1b to the frame 6. The damping materials 1a, 1b are vibration energy absorption members having a property that a loss coefficient is increased by being compressed in comparison with that before compression, and having a loss coefficient by a mechanical impedance method in a compressed state, of 0.05 or more. In the damping frame 10, vibration energy is efficiently transmitted to the damping materials 1a, 1b in a case when the frame 6 is vibrated, and the damping materials 1a, 1b convert the vibration energy for vibrating the frame 6 into heat energy. The damping clip 4 can be easily disposed on one object surface, and efficiently reduce vibration so that radiation noise caused by the vibration can be remarkably reduced.SELECTED DRAWING: Figure 1 【課題】被振動体に伝達される振動を十分に低減可能な振動低減効果の高い制振構造体の提供。【解決手段】制振フレーム10は、制振クリップ4とフレーム6とを有する。制振クリップ4はフレーム6に制振材1a、1bをそれぞれ押し当てることで、フレーム6との間で制振材1a、1bを圧縮して保持する。制振材1a、1bは共に、圧縮されることによって圧縮前よりも損失係数が高くなる特性を持ち、圧縮された状態で機械インピーダンス法による損失係数が0.05以上である振動エネルギー吸収部材である。この制振フレーム10では、フレーム6が振動した場合に、制振材1a、1bに対して振動エネルギーが効率的に伝達されて、制振材1a、1bはフレーム6を振動させる振動エネルギーを熱エネルギーに変換する。制振クリップ4は1物体面上に容易に設置可能であり、また効率的に振動を低減させて振動起因の放射音を大幅に低減することができる。【選択図】図1
Bibliography:Application Number: JP20150057875