SUBSTRATE LAMINATION SYSTEM AND METHOD

• Main Authors: JAMES D SAMPICA, JOSEPH L TCHON, PAUL R NEMETH, VINCENT P MARZEN, TRACY J BARNIDGE
• Format: Patent
• Language: English; Japanese
• Published: 06.10.2016
• Subjects: ADVERTISING; BASIC ELECTRIC ELEMENTS; CRYPTOGRAPHY; DISPLAY; DISPLAYING; EDUCATION; ELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LABELS OR NAME-PLATES; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; PERFORMING OPERATIONS; PHYSICS; SEALS; SEMICONDUCTOR DEVICES; SIGNS; TRANSPORTING

PROBLEM TO BE SOLVED: To provide a method and apparatus for positioning and laminating a plurality of substrates, which can protect the substrates from impacts.SOLUTION: A method comprises: disposing a second substrate 102 on a support surface of a planarization tool; disposing a pressure-sensitive...