SUBSTRATE LAMINATION SYSTEM AND METHOD

• Main Authors: JAMES D SAMPICA, JOSEPH L TCHON, PAUL R NEMETH, VINCENT P MARZEN, TRACY J BARNIDGE
• Format: Patent
• Language: English; Japanese
• Published: 06.10.2016
• Subjects: ADVERTISING; BASIC ELECTRIC ELEMENTS; CRYPTOGRAPHY; DISPLAY; DISPLAYING; EDUCATION; ELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LABELS OR NAME-PLATES; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; PERFORMING OPERATIONS; PHYSICS; SEALS; SEMICONDUCTOR DEVICES; SIGNS; TRANSPORTING

PROBLEM TO BE SOLVED: To provide a method and apparatus for positioning and laminating a plurality of substrates, which can protect the substrates from impacts.SOLUTION: A method comprises: disposing a second substrate 102 on a support surface of a planarization tool; disposing a pressure-sensitive adhesive layer 103 on the first substrate; disposing a first substrate 101 on the pressure-sensitive adhesive layer; creating a sealed cavity with a flexible membrane 120 positioned between the planarization tool and a pressurization tool; and applying a pressure created within the sealed cavity to the first substrate, pressure-sensitive adhesive layer and second substrate.SELECTED DRAWING: Figure 1 【課題】基板を衝撃から保護可能であり、複数の基板を位置決めして積層を行う方法及び装置を提供する。【解決手段】平面化工具のサポート表面上に第２の基板１０２を配置し、第１の基板上に感圧接着剤層１０３を配置し、感圧接着剤層上に第１の基板１０１を配置し、平面化工具と加圧工具の間に位置する柔軟な膜１２０にて、密封空洞を作成し、密封空洞内に作成された圧力を第１の基板と感圧接着剤層と第２の基板とに印加する。【選択図】図１