CONNECTION METHOD, AND ASSEMBLY

• Main Authors: KAKO NAOMI, YAMADA YASUNOBU
• Format: Patent
• Language: English; Japanese
• Published: 29.09.2016
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMISTRY; COMPOSITIONS BASED THEREON; CURRENT COLLECTORS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LINE CONNECTORS; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP

PROBLEM TO BE SOLVED: To provide a connection method which allows for sufficient temporary fixing, even at the temperature of human skin, without requiring any special facility and process for temporary fixing.SOLUTION: A connection method performing anisotropic conductive connection of the terminal of a first circuit member 1 and the terminal of a second circuit member 3 includes a first arrangement step of arranging an anisotropic conductive film 2 on the terminal of the first circuit member 1, a second arrangement step of arranging the second circuit member 3 on the anisotropic conductive film 2, so that the terminal of the second circuit member 3 comes into contact with the anisotropic conductive film 2, a temporary fixing step of pressing the second circuit member 3 at the temperature of human skin, and a hot press step of hot pressing the second circuit member 3 by the hot pressing member 3. The anisotropic conductive film 2 contains liquid epoxy resin having a viscosity of 15-150 mPa s.SELECTED DRAWING: Figure 1 【課題】仮固定のための特別な設備及び工程を要さずに、仮固定を人肌の温度で行っても、十分な仮固定を行うことができる接続方法を提供する。【解決手段】第１の回路部材１の端子と第２の回路部材３の端子とを異方性導電接続させる接続方法であって、第１の回路部材１の端子上に、異方性導電フィルム２を配置する第１の配置工程と、異方性導電フィルム２上に第２の回路部材３を、第２の回路部材３の端子が異方性導電フィルム２と接するように配置する第２の配置工程と、第２の回路部材３を人肌の温度で押圧する仮固定工程と、第２の回路部材３を加熱押圧部材により加熱及び押圧する加熱押圧工程と、を含む。異方性導電フィルム２が、粘度が１５ｍＰａ・ｓ〜１５０ｍＰａ・ｓの液状エポキシ樹脂を含有する。【選択図】図１