SEMICONDUCTOR LIGHT EMITTING ELEMENT
PROBLEM TO BE SOLVED: To provide a semiconductor light emitting element which can improve efficiency.SOLUTION: According to an embodiment, a semiconductor light emitting element includes a substrate, first through sixth semiconductor layers, first and second conductive layer, a structure and a first...
Saved in:
Main Authors | , , , |
---|---|
Format | Patent |
Language | English Japanese |
Published |
29.09.2016
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Summary: | PROBLEM TO BE SOLVED: To provide a semiconductor light emitting element which can improve efficiency.SOLUTION: According to an embodiment, a semiconductor light emitting element includes a substrate, first through sixth semiconductor layers, first and second conductive layer, a structure and a first insulation layer. The first conductive layer is electrically connected with the second semiconductor layer. The second conductive layer is electrically connected with the fifth semiconductor layer. At least a part of the structure is provided between the first semiconductor layer and the fourth semiconductor layer. The third conductive layer includes a first region, a second region and a third region between the first region and the second region. At least a part of the first insulation layer is provided between the third conductive layer and the fifth semiconductor layer. A fifth region of the first conductive layer is electrically connected with the first region. A part of the fourth semiconductor layer is provided between the second region and the second conductive layer. The structure is provided between the third region and the substrate. A thickness of the structure is smaller than a distance between the second region and the second conductive layer.SELECTED DRAWING: Figure 1
【課題】効率を向上できる半導体発光素子を提供する。【解決手段】実施形態によれば、半導体発光素子は、基体と、第1〜第6半導体層と、第1〜第2導電層と、構造体と、第1絶縁層と、を含む。第1導電層は、第2半導体層と電気的に接続される。第2導電層は、第5半導体層と電気的に接続される。構造体の少なくとも一部は、第1半導体層と第4半導体層との間に設けられる。第3導電層は、第1領域と、第2領域と、第1領域と第2領域との間の第3領域と、を含む。第1絶縁層の少なくとも一部は、第3導電層と第5半導体層との間に設けられる。第1導電層の第5領域は、第1領域と電気的に接続される。第4半導体層の一部は、第2領域と第2導電層との間に設けられる。構造体は、第3領域と基体との間に設けられる。構造体の厚さは、第2領域と第2導電層との間の距離よりも小さい。【選択図】図1 |
---|---|
Bibliography: | Application Number: JP20150052125 |