SEMICONDUCTOR DEVICE
PROBLEM TO BE SOLVED: To suppress occurrence of a connection failure when an information apparatus and a peripheral device are connected with each other by means of USB.SOLUTION: A semiconductor device that enables data transfer by USB by being connected with a receptacle, comprises: a circuit board...
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Main Authors | , , , |
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Format | Patent |
Language | English Japanese |
Published |
29.09.2016
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Subjects | |
Online Access | Get full text |
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Summary: | PROBLEM TO BE SOLVED: To suppress occurrence of a connection failure when an information apparatus and a peripheral device are connected with each other by means of USB.SOLUTION: A semiconductor device that enables data transfer by USB by being connected with a receptacle, comprises: a circuit board that has a wiring board with a plurality of connection pads, and a semiconductor component mounted on the wiring board; and a terminal part provided on the circuit board. The terminal part comprises: a terminal member that has a first connection part connectable with the receptacle, a tail part provided at an end part, and a junction part for joining the first connection part and the tail part; and an insulation member that holds at least a part of the junction part. The junction part has a second connection part exposed from the insulation member to the circuit board side, and electrically connected with at least one of the plurality of connection pads.SELECTED DRAWING: Figure 1
【課題】USBにより情報機器と周辺機器とを接続する際の接続不良の発生を抑制する。【解決手段】レセプタクルと接続することによりUSBによるデータ転送が可能な半導体装置であって、複数の接続パッドを有する配線基板と、配線基板に搭載された半導体部品とを備える回路基板と、回路基板上に設けられた端子部と、を具備する。端子部は、レセプタクルとの接続が可能な第1の接続部と、端部に設けられたテール部と、第1の接続部とテール部とを連接する連接部と、を有する端子部材と、少なくとも連接部の一部を保持する絶縁部材と、を備える。連接部は、絶縁部材から回路基板側に露出し、かつ複数の接続パッドの少なくとも一つに電気的に接続された第2の接続部を有する。【選択図】図1 |
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Bibliography: | Application Number: JP20150052711 |