ELECTRONIC DEVICE AND METHOD OF MANUFACTURING PHOTOELECTRIC CONVERSION DEVICE

• Main Authors: KIMURA TETSUYA, TAKAMI KOKI
• Format: Patent
• Language: English; Japanese
• Published: 23.09.2016
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To make an electrode constituting a wiring pattern hardly scraped, when flattening an insulation layer surface by CMP method.SOLUTION: A method of manufacturing an electronic device has a step of forming a first electrode on a substrate, a step of forming a first insulation layer on the first electrode, a step of forming a second electrode on the first insulation layer, a step of forming a second insulation layer on the second electrode, and a step of polishing the surface of the second insulation layer by CMP method. The end of the second electrode closest to the outer periphery of the substrate is formed at a position, closer to the outer periphery of the substrate, than the end of the first electrode closest to the outer periphery of the substrate.SELECTED DRAWING: Figure 1 【課題】絶縁層表面をＣＭＰ法で平坦化する際に、配線パターンを構成する電極が削られにくくすること。【解決手段】基板上に第１の電極を形成する工程と、第１の電極上に第１の絶縁層を形成する工程と、第１の絶縁層上に第２の電極を形成する工程と、第２の電極上に第２の絶縁層を形成する工程と、第２の絶縁層の表面をＣＭＰ法によって研磨する工程とを有し、第２の電極のうち、基板の外周に最も近い端部は、第１の電極のうち、基板の外周に最も近い端部よりも、基板の外周に近い位置に形成されることを特徴とする電子デバイスの製造方法が提供される。【選択図】図１