INTERLAYER CONNECTION SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

• Main Authors: KATAYAMA KAORU, MIITSU TAKESHI, YODA TOMOKO, USHIFUSA NOBUYUKI, ONO TAKAYUKI
• Format: Patent
• Language: English; Japanese
• Published: 23.09.2016
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

PROBLEM TO BE SOLVED: To provide an interlayer connection substrate that is low in cost and high in transmission quality and reliability.SOLUTION: In an interlayer connection substrate, a first substrate is inserted into a second substrate so that the first substrate is electrically connected to the second substrate, the first substrate having a cross section formed in a multistep shape where a lower part is small and an upper part is large, and the second substrate having a recessed portion, which is formed to be matched to the outer shape of the first substrate, formed thereto; and wirings of the first substrate and wirings of the second substrate are electrically connected at a step part of the first substrate and at a step part of the second substrate facing the step part of the first substrate.SELECTED DRAWING: Figure 24 【課題】低コストで高い伝送品質、信頼性を持った構成の層間接続基板を提供する。【解決手段】層間接続基板を、断面を下部が小さく上部が大きい多段形状に形成した第１の基板を、第１の基板の外形形状に合わせた凹部を形成した第２の基板にはめ込んで第１の基板と第２の基板とを電気的に接続して構成し、第１の基板の段差部と、第１の基板の段差部と対向する第２の基板の段差部において、第１の基板の配線と第２の基板の配線とを電気的に接続するように構成した。【選択図】 図２４