METHOD OF MANUFACTURING WIRING BOARD AND WIRING BOARD

• Main Author: KOSHIMIZU KAZUTOSHI
• Format: Patent
• Language: English; Japanese
• Published: 05.09.2016
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; COLOUR PRINTING; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LINING MACHINES; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING,INKING, DAMPING, OR THE LIKE; PERFORMING OPERATIONS; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM; PRINTED CIRCUITS; PRINTING; PRINTING MACHINES OR PRESSES; PRINTING PLATES OR FOILS; PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; STAMPS; TRANSPORTING; TYPEWRITERS

PROBLEM TO BE SOLVED: To provide a method of manufacturing a wiring board in which confusion of wirings can be suppressed, by suppressing the swell of a transfer body at a bend of the wiring.SOLUTION: A method of manufacturing a wiring board 1 includes a first step (filling step S1) for filling the wiring groove 441 of a photogravure 43 with a conductive material 5, and a second step (an acceptance step S2 and a transfer step S3) for transferring the conductive material 5 to a base material 2 from the photogravure 43 via a bracket 49 and forming a wiring 32 on the base material 2. The wiring groove 441 has a bend 443 where the extension direction of the wiring groove 441 changes, and a convex part 444 is formed at least in the bend 443.SELECTED DRAWING: Figure 6 【課題】配線の屈曲部において、転写体の膨潤を抑え、当該配線同士が混線するのを抑制することができる配線基板の製造方法を提供する。【解決手段】 配線基板１の製造方法は、グラビア版４３の配線溝４４１に導電性材料５を充填する第１の工程（充填工程Ｓ１）と、グラビア版４３からブラケット４９を介して基材２に導電性材料５を転写して、配線３２を基材２上に形成する第２の工程（受理工程Ｓ２および転写工程Ｓ３）と、を備え、配線溝４４１は、配線溝４４１の延在方向が変化する屈曲部４４３を有し、少なくとも屈曲部４４３の内部に凸部４４４が形成されている。【選択図】 図６