TEMPERATURE MEASUREMENT SYSTEM
PROBLEM TO BE SOLVED: To provide a temperature measurement system enabled to measure a correct temperature without increasing a weight or a volume of a signal transmission cable in the application that the signal transmission cable is laid in a high temperature environment.SOLUTION: A temperature me...
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Main Authors | , |
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Format | Patent |
Language | English Japanese |
Published |
05.09.2016
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Subjects | |
Online Access | Get full text |
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Summary: | PROBLEM TO BE SOLVED: To provide a temperature measurement system enabled to measure a correct temperature without increasing a weight or a volume of a signal transmission cable in the application that the signal transmission cable is laid in a high temperature environment.SOLUTION: A temperature measurement system includes: a temperature sensor 1 for outputting an electrical signal according to a detection temperature; a signal transmission cable 10 for transmitting the electrical signal outputted from the temperature sensor; and a temperature measurement device 6 for inputting the electrical signal transmitted from the signal transmission cable so as to be converted into the detection temperature. The signal transmission cable has a non-organic insulation cable 2 accommodating a metal element wire 12 whose one end is connected to one terminal of the temperature sensor in a metal sheath 11 filled with a nonorganic insulation material 13, and a nonorganic insulation cable 3 accommodating a metal element wire 15 whose one end is connected to the other terminal of the temperature sensor in a metal sheath 14 filled with a nonorganic insulation material 16.SELECTED DRAWING: Figure 1
【課題】信号伝送ケーブルが高温環境に敷設される用途において、信号伝送ケーブルの重量や体積を著しく増すことなく、正確な温度計測を可能とした温度計測システムを提供する。【解決手段】検出温度に応じた電気信号を出力する温度センサ1と、前記温度センサから出力された電気信号を伝送する信号伝送ケーブル10と、前記信号伝送ケーブルから伝送された電気信号を入力して検出温度に換算する温度計測装置6とを備えた温度計測システムにおいて、前記信号伝送ケーブルは、前記温度センサの一方の端子に一端が接続された1本の金属素線12を無機絶縁材13を充填した金属シース11に収容してなる無機絶縁ケーブル2と、前記温度センサの他方の端子に一端が接続された金属素線15を無機絶縁材16を充填した金属シース14に収容してなる無機絶縁ケーブル3とを有する。【選択図】 図1 |
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Bibliography: | Application Number: JP20150040160 |