PLATED FIBER AND METHOD FOR MANUFACTURING THE SAME

• Main Authors: OKUNO TOMOAKI, YONEZAWA SHUICHI
• Format: Patent
• Language: English; Japanese
• Published: 05.09.2016
• Subjects: CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; LAUNDERING; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; TEXTILES; TREATMENT OF TEXTILES OR THE LIKE; TREATMENT, NOT PROVIDED FOR ELSEWHERE IN CLASS D06, OF FIBRES, THREADS, YARNS,FABRICS, FEATHERS, OR FIBROUS GOODS MADE FROM SUCH MATERIALS

PROBLEM TO BE SOLVED: To form an electroless plating film excellent in adhesion between a fiber and a metal coating without reducing the strength of a polymer fiber material and using a palladium catalyst.SOLUTION: The method for manufacturing a plated fiber comprises: subjecting an organic polymer fiber to electron beam irradiation treatment to graft polymerize a carboxyl group, sulfonic group or phosphate group containing monomer to 0.1-40 wt.% of the organic polymer fiber; depositing metal salt on the organic polymer fiber by immersing the organic polymer fiber in a metal salt solution; reducing and activating the metal salt deposited on the surface of the organic polymer fiber; immersing the organic polymer fiber in a plating solution to perform electroless plating; and forming an electroless plating film excellent in adhesion between a fiber and a metal coating without reducing the strength of a polymer fiber material by forming a metal plating layer.SELECTED DRAWING: None 【課題】本発明の目的は、高分子繊維材料の強度を低下させずに、しかもパラジウム触媒を用いることなく繊維と金属皮膜の密着性の優れた無電解めっき皮膜を形成することにある。【解決手段】有機高分子繊維に電子線照射処理してカルボキシル基またはスルホン酸基またはリン酸基含有モノマーを有機高分子繊維重量の０．１〜４０％グラフト重合させ、その後金属塩溶液に浸漬することで有機高分子繊維に金属塩付着させ、次に有機高分子繊維表面に付着した金属塩を還元して活性化処理し、次にこの有機高分子繊維をめっき液に浸漬して無電解めっき処理を行い、金属めっき層を形成することによって、高分子繊維材料の強度を低下させずに、繊維と金属皮膜の密着性の優れた無電解めっき皮膜を形成させることができることを見出し本発明に到達した。【選択図】なし