ELECTROMAGNETIC WAVE SHIELDING SHEET, ELECTROMAGNETIC WAVE SHIELDING WIRING CIRCUIT BOARD, AND ELECTRONIC DEVICE

• Main Authors: MATSUZAWA TAKAHIRO, SAKAGUCHI GO, KOBAYASHI HIDENORI, INOUE SHOTA, HAYASAKA TSUTOMU
• Format: Patent
• Language: English; Japanese
• Published: 01.09.2016
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PERFORMING OPERATIONS; PRINTED CIRCUITS; TRANSPORTING

PROBLEM TO BE SOLVED: To provide an electromagnetic wave shielding sheet having excellent bondability with a component and capable of maintaining good transmission characteristics when used in a component for high frequency applications while ensuring shielding against electromagnetic waves and the like.SOLUTION: An electromagnetic wave shielding sheet according to the present invention comprises a laminate for shielding at least a part of a component and is provided with: an adhesive layer 1 which is bonded to a component 20 by performing a bonding process; a conductive layer 2; and an insulating layer 3. The adhesive layer 1 includes, as a binder component, (I) a thermoplastic resin (A), and at least one of (II) a thermosetting resin (B) and a curable compound (C) for the thermosetting resin (B). A film after subjecting the binder component to a thermocompression bonding process satisfies the following conditions (i) and (ii) at a frequency of 1 GHz and 23°C: (i) the relative dielectric constant is in a range between 1 and 3, and (ii) the dielectric loss tangent is between 0.0001 and 0.02.SELECTED DRAWING: Figure 3 【課題】部品との接合性に優れ、電磁波等のシールド性を確保しつつ、高周波用途の部品に用いる場合においても良好な伝送特性を維持できる電磁波シールドシートを提供する。【解決手段】本発明に係る電磁波シールドシートは、部品の少なくとも一部をシールドする積層体からなり、接合処理を行うことにより部品２０と接合される接着層１、導電層２及び絶縁層３とを備える。接着層１は、バインダー成分として、（Ｉ）熱可塑性樹脂（Ａ）、および（ＩＩ）熱硬化性樹脂（Ｂ）と熱硬化性樹脂（Ｂ）に対する硬化性化合物（Ｃ）との少なくとも一方を含み、バインダー成分を熱圧着処理した後の被膜が周波数１ＧＨｚ、２３℃において以下の（ｉ）および（ｉｉ）を満たす。（ｉ）比誘電率が１〜３の範囲であり、（ｉｉ）誘電正接が０．０００１〜０．０２である。【選択図】図３