SUBSTRATE PROCESSING DEVICE

• Main Authors: HATANO AKITO, KOBAYASHI KENJI, SHIMAI MOTOYUKI, NISHIMURA YUDAI, SAWASHIMA HAYATO
• Format: Patent
• Language: English; Japanese
• Published: 01.09.2016
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To enhance the uniformity of processing while reducing the amount of consumption of a process liquid supplied to a substrate.SOLUTION: In a substrate processing device, first to fourth nozzles 26A to 26D, each include discharge ports arrayed in a radial direction Dr in plane view. The discharge ports are connected to upstream paths branched from a supply flow path. The first to fourth nozzles 26A to 26D have arm parts 28 arrayed in a horizontal array direction D2. In the arm parts 28 of the first to fourth nozzles 26A to 26D, their tip portions 28a are arranged so that they are displaced in a horizontal longitudinal direction D1 and arrayed in the order of the first to fourth nozzles 26A to 26D with respect to the longitudinal direction D1.SELECTED DRAWING: Figure 4 【課題】基板に供給される処理液の消費量を低減しながら、処理の均一性を高めること。【解決手段】第１ノズル２６Ａ〜第４ノズル２６Ｄは、平面視で径方向Ｄｒに並んだ複数の吐出口を含む。複数の吐出口は、供給流路から分岐した複数の上流流路にそれぞれ接続されている。第１ノズル２６Ａ〜第４ノズル２６Ｄのアーム部２８は、水平な配列方向Ｄ２に並んでいる。第１ノズル２６Ａ〜第４ノズル２６Ｄのアーム部２８の先端２８ａは、水平な長手方向Ｄ１に関して第１ノズル２６Ａ〜第４ノズル２６Ｄの順番で並ぶように長手方向Ｄ１にずれている。【選択図】図４