Sn PLATED MATERIAL FOR ELECTRONIC COMPONENT
PROBLEM TO BE SOLVED: To provide a Sn plated material preventing generation of a Sn powder and having excellent surface gloss as a conductive spring material of a connector, a terminal, or the like.SOLUTION: An Sn plated material has a Sn plated layer subjected to reflow treatment on a substrate of...
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Main Authors | , , |
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Format | Patent |
Language | English Japanese |
Published |
01.09.2016
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Subjects | |
Online Access | Get full text |
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Summary: | PROBLEM TO BE SOLVED: To provide a Sn plated material preventing generation of a Sn powder and having excellent surface gloss as a conductive spring material of a connector, a terminal, or the like.SOLUTION: An Sn plated material has a Sn plated layer subjected to reflow treatment on a substrate of a copper or copper alloy strip. The reflow Sn plated layer consists of an upper Sn layer and a lower Cu-Sn alloy layer. One or more radial Sn solidification structures exist per 35 mmin the outermost surface of the Sn-plated material. The surface roughness Ra in a direction perpendicular to the rolling direction of the outermost surface of the Sn plated layer is 0.05 μm or less.SELECTED DRAWING: None
【課題】コネクタや端子等の導電性ばね材としてSn粉の発生を防止し、且つ良好な表面光沢を有するSnめっき材を提供する。【解決手段】本発明は、銅又は銅合金条の基材上にリフロー処理を施したSnめっき層を有するSnめっき材であって、リフローSnめっき層は上側のSn層と下側のCu−Sn合金層で構成され、Snめっき材の最表面において、放射状のSn凝固組織が35mm2当たり1個以上存在し、Snめっき材の最表面の圧延直角方向の表面粗さRaが0.05μm以下であることを特徴とするSnめっき材である。【選択図】なし |
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Bibliography: | Application Number: JP20150034246 |