EPOXY RESIN COMPOSITION, EPOXY RESIN SHEET, AND METAL BASE CIRCUIT BOARD USING THE SAME

• Main Authors: HOMMA SAO, SERIZAWA SHINYA, MIYATA KENJI, IIJIMA SAYU, KIMOTO YUKI, KUMAGAI RYOTA
• Format: Patent
• Language: English; Japanese
• Published: 01.09.2016
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

PROBLEM TO BE SOLVED: To provide an epoxy resin composition having good thermal conductivity, adhesiveness, and insulation properties, and to provide a sheet and a metal base circuit board using the epoxy resin composition.SOLUTION: The epoxy resin composition contains aluminum nitride coarse partic...