EPOXY RESIN COMPOSITION, EPOXY RESIN SHEET, AND METAL BASE CIRCUIT BOARD USING THE SAME

• Main Authors: HOMMA SAO, SERIZAWA SHINYA, MIYATA KENJI, IIJIMA SAYU, KIMOTO YUKI, KUMAGAI RYOTA
• Format: Patent
• Language: English; Japanese
• Published: 01.09.2016
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

PROBLEM TO BE SOLVED: To provide an epoxy resin composition having good thermal conductivity, adhesiveness, and insulation properties, and to provide a sheet and a metal base circuit board using the epoxy resin composition.SOLUTION: The epoxy resin composition contains aluminum nitride coarse particles and alumina fine particles. The average particle diameter of the aluminum nitride coarse particles is 40-80 μm, and the average particle diameter of the alumina fine particles is 0.3-1.5 μm. The content of the aluminum nitride coarse particles is adjusted to 60-80 vol.% based on the total of the aluminum nitride coarse particles and the alumina fine particles. Thus, the epoxy resin composition having good thermal conductivity, adhesiveness, and insulation properties is obtained.SELECTED DRAWING: None 【課題】熱伝導性、接着性および絶縁性が良好なエポキシ樹脂組成物を提供する。さらに、このエポキシ樹脂組成物を用いたシートおよび金属ベース回路基板を提供する。【解決手段】窒化アルミ粗粒子とアルミナ微粒子を含有し、窒化アルミ粗粒子の平均粒子径が４０〜８０μｍであり、アルミナ微粒子の平均粒子径が０．３〜１．５μｍであり、窒化アルミ粗粒子とアルミナ微粒子の総和に対する窒化アルミ粗粒子の含有率を６０〜８０体積％に調製することで、熱伝導性、接着性および絶縁性が良好なエポキシ樹脂組成物が得られる。【選択図】なし