CHIP PICKUP DEVICE AND CHIP PICKUP METHOD

• Main Author: TADAKI SHINJI
• Format: Patent
• Language: English; Japanese
• Published: 22.08.2016
• Subjects: BASIC ELECTRIC ELEMENTS; CONVEYING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; HANDLING THIN OR FILAMENTARY MATERIAL; PACKING; PERFORMING OPERATIONS; PNEUMATIC TUBE CONVEYORS; SEMICONDUCTOR DEVICES; SHOP CONVEYOR SYSTEMS; STORING; TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING ORTIPPING; TRANSPORTING

PROBLEM TO BE SOLVED: To provide a chip pickup device which further easily exfoliates a chip and a collet while preventing the chip from being damaged.SOLUTION: The chip pickup device includes the collet. The collet comprises: a holder 2 having an opening that exposed an internally formed space; a curved surface 3b which is formed within the holder 2 at a side opposite to the opening 2a and protrudes in the space while being at least partially curved from one side to the other side; a first suction hole 3a that penetrates the curved surface 3b and is connected to pressure reduction control parts 6-8; an elastic adsorption plate 4 which is fitted into the opening 2a, includes a plurality of second suction holes 4a on a contact surface with a chip C on a tape 12 and is deformed in accordance with a pressure within a collet 2; and a suction groove 3c which is formed on at least one of mutually opposite surfaces of the adsorption plate 4 and the curved surface 3b and overlapped with at least a part of the first suction holes 3a and the second suction holes 4a.SELECTED DRAWING: Figure 4 【課題】チップの破損を防止しつつチップとコレットをさらに容易に剥離するチップ用ピックアップ装置を提供する。【解決手段】内部に形成された空間を露出する開口部を有するホルダ２と、ホルダ２内で前記開口部２ａと反対側に形成され、一側から他側に向けて少なくとも一部が湾曲して前記空間に突出する曲面３ｂと、前記曲面３ｂを貫通し、減圧制御部６〜８に接続される第１吸気孔３ａと、開口部２ａに嵌め込まれ、テープ１２上のチップＣとの接触面で複数の第２吸気孔４ａを有し、コレット２内の圧力に応じて変形する弾性の吸着板４と、吸着板４と前記曲面３ｂの互いの対向面のうち少なくとも一方に形成され、第１吸気孔３ａと第２吸気孔４ａの少なくとも一部に重ねられる吸気溝３ｃと、を有するコレットを含む。【選択図】図４