ELECTRONIC COMPONENT BUILT-IN WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

• Main Authors: NAGANO NORIKO, KIYOTA YASUHIRO
• Format: Patent
• Language: English; Japanese
• Published: 22.08.2016
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

PROBLEM TO BE SOLVED: To provide an electronic component built-in wiring board capable of improving the reliability of a built-in electronic component.SOLUTION: An electronic component built-in wiring board comprises: an insulating base material including a wiring circuit pattern including a thermosetting resin and formed on at least one surface thereof, and a via hole conductor 3 composed of a plating layer electrically connected to the wiring circuit pattern; and an electronic component 4 which is embedded in the insulating base material and includes a ceramic body 5 and an external electrode 6 provided in a part of the ceramic body 5, and in which the external electrode 6 is connected to the via hole conductor 3. The external electrode 6 includes a base electrode 6a, a nickel plating layer 6b1 covering the base electrode 6a, and a copper plating layer 6b2 covering the nickel plating layer 6b1. The copper plating layer 6b2 includes a region 7 a part of which has been subjected to etching treatment, and is connected to the via hole conductor 3 in the region 7.SELECTED DRAWING: Figure 3 【課題】 内蔵した電子部品の信頼性が向上した電子部品内蔵型配線基板を提供する。【解決手段】 電子部品内蔵型配線基板であって、熱硬化性樹脂を含む、少なくとも一方の表面に形成された配線回路パターンと配線回路パターンと電気的に接続されためっき層からなるビアホール導体３とを有する絶縁基材と、絶縁基材内に埋設された、セラミック本体５とセラミック本体５の一部に設けられた外部電極６とを有しており、外部電極６がビアホール導体３と接続された電子部品４とを備えており、外部電極６は、下地電極６ａと下地電極６ａを覆っているニッケルめっき層６ｂ１およびニッケルめっき層６ｂ１を覆っている銅めっき層６ｂ２とを含んでおり、銅めっき層６ｂ２が表面の一部にエッチング処理された領域７を有しており、エッチング処理された領域７でビアホール３と接続されている。【選択図】 図３