ELECTROSPRAY DEVICE

PROBLEM TO BE SOLVED: To provide an electrospray device capable of improving productivity when forming a thin film on a main surface and a reverse surface of a substrate.SOLUTION: This electrospray device 100 comprises a nozzle 1 for atomizing a solution material 210 in a state of applying voltage t...

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Bibliographic Details
Main Authors ISHI KAZUTERU, HATAKEYAMA TATSUO, YAMAMOTO KIYOTO
Format Patent
LanguageEnglish
Japanese
Published 22.08.2016
Subjects
APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
ATOMISING APPARATUS
NOZZLES
PERFORMING OPERATIONS
SPRAYING APPARATUS
SPRAYING OR ATOMISING IN GENERAL
TRANSPORTING
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Summary:PROBLEM TO BE SOLVED: To provide an electrospray device capable of improving productivity when forming a thin film on a main surface and a reverse surface of a substrate.SOLUTION: This electrospray device 100 comprises a nozzle 1 for atomizing a solution material 210 in a state of applying voltage thereto, and a substrate 200 is supported in a state of exposing at least a main surface 200a and a reverse surface 200b, and the nozzle 1 includes a first nozzle 1a arranged on the main surface 200a side and a second nozzle 1b arranged on the reverse surface 200b side in a state of exposing at least the main surface 200a and the reverse surface 200b.SELECTED DRAWING: Figure 3 【課題】基板の主表面および裏面に薄膜を形成する際の生産性を向上させることが可能なエレクトロスプレー装置を提供する。【解決手段】このエレクトロスプレー装置１００は、溶液材料２１０に電圧を印加した状態で噴霧するノズル１を備え、基板２００は、少なくとも主表面２００ａおよび裏面２００ｂが露出された状態で支持されており、ノズル１は、少なくとも主表面２００ａおよび裏面２００ｂが露出された状態の主表面２００ａ側に配置される第１ノズル１ａと、裏面２００ｂ側に配置される第２ノズル１ｂとを含む。【選択図】図３
Bibliography:Application Number: JP20150028882