OPTICAL SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

• Main Authors: MIKI MICHIHIDE, FUJITOMO MASATO, TANDA YUICHIRO, TAMAOKI HIROTO, NISHIJIMA SHINJI
• Format: Patent
• Language: English; Japanese
• Published: 18.08.2016
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide an optical semiconductor device which is thin and has high light extraction efficiency.SOLUTION: An optical semiconductor device manufacturing method comprises: a first process of forming on a support substrate, a plurality of first and second conductive members which are arranged at a distance from each other; a second process of providing a base substrate 106 composed of light-blocking resin between the first and second conductive members; a third process of mounting an optical semiconductor element on the first and second conductive members; a fourth process of covering the optical semiconductor element with an encapsulation member 104 composed of a translucent resin; and a fifth process of removing a support substrate and subsequently singulating an optical semiconductor device 100.SELECTED DRAWING: Figure 1A 【課題】薄型で光取り出し効率の高い光半導体装置を提供する。【解決手段】支持基板上に、互いに離間する第１および第２の導電部材を複数形成する第１の工程と、第１及び第２の導電部材の間に遮光性樹脂からなる基体１０６を設ける第２の工程と、第１及び第２の導電部材上に光半導体素子を載置させる第３の工程と、光半導体素子を透光性樹脂からなる封止部材１０４で被覆する第４の工程と、支持基板を除去後光半導体装置１００を個片化する第５の工程と、を有する光半導体装置の製造方法。【選択図】図１Ａ