CONNECTOR

PROBLEM TO BE SOLVED: To improve the connection reliability between terminals.SOLUTION: A connector 1 comprises: a pair of first terminals 10 arranged in parallel to each other; a second terminal 20 electrically connected with each of the pair of first terminals 10 by being press-contacted with the...

Full description

Saved in:
Bibliographic Details
Main Authors TAKADA KENSAKU, HATTORI YASUHIRO, MUKUNO JUNICHI, MIYAZAKI TADASHI, AIZAWA KATSUHIKO
Format Patent
LanguageEnglish
Japanese
Published 18.08.2016
Subjects
Online AccessGet full text

Cover

Loading…
More Information
Summary:PROBLEM TO BE SOLVED: To improve the connection reliability between terminals.SOLUTION: A connector 1 comprises: a pair of first terminals 10 arranged in parallel to each other; a second terminal 20 electrically connected with each of the pair of first terminals 10 by being press-contacted with the pair of first terminals 10 in such a form that the pair of first terminals 10 are sandwiched as a block; and a ceramic member 30 with an insulation property that is sandwiched between and contacted with the pair of first terminals 10. Since the ceramic member 30 is less likely to be thermally deformed or deformed under a load compared with a resin and the like, even when a contact resistance between the first terminal 10 and the second terminal 20 increases, a contact pressure at the time when the second terminal 20 is press-contacted with the first terminal 10 is less likely to be reduced. Therefore, conduction failures between the first terminal 10 and the second terminal 20 caused by aged deterioration and the like can be suppressed, and the connection reliability between the terminals can be improved.SELECTED DRAWING: Figure 1 【課題】端子間の接続信頼性を向上させること。【解決手段】コネクタ1は、並列配置された一対の第1端子10と、一対の第1端子10を一括して挟み込む形で一対の第1端子10に押圧接触することで一対の第1端子10の各々と電気的に接続される第2端子20と、絶縁性を有し、一対の第1端子10の間に挟持されて一対の第1端子10と接触するセラミックス部材30と、を備える。セラミックス部材30は樹脂等と比べて熱変形や荷重変形し難いため、第1端子10と第2端子20との間の接触抵抗が増加した場合であっても、第2端子20が第1端子10に押圧接触する接触圧は低下し難い。このため、経年劣化等に起因する第1端子10と第2端子20との間の導通不良を抑制することができ、端子間の接続信頼性を向上させることができる。【選択図】図1
Bibliography:Application Number: JP20150024117