SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

• Main Authors: TAKAYAMA SHINICHI, NANBA MASATAKA, SUMINO HIROSHI, KOGA MINEO
• Format: Patent
• Language: English; Japanese
• Published: 12.08.2016
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a semiconductor device capable of easily packaging semiconductor devices of different types at a low cost and manufacturing method thereof.SOLUTION: A semiconductor chip 50 is mounted on a first plane F1-10 of a metal part 10 which has a first plane F1-10 and a second plane F2-10 located at the opposite side of the first plane, and is electrically connected to the metal part 10 (chip mounting part). A terminal part 80 has: a third face F3-80 which comes into contact with the second plane F2-10 of the metal part 10; a fourth face F4-80 located at the opposite side of the third face F3-80; and side faces F80S between the third face F3-80 and the fourth face F4-80. A resin 70 is formed on the second plane F2-10 of the metal part 10 and the side faces F80S of the terminal part 80.SELECTED DRAWING: Figure 3 【課題】異なる種類の半導体装置を安価、かつ、容易にパッケージングする半導体装置及びその製造方法を提供する。【解決手段】半導体チップ５０は、第１面Ｆ１−１０と、第１面の反対側にある第２面Ｆ２−１０とを有する金属部１０の第１面Ｆ１−１０上に搭載され、金属部１０（チップ搭載部）と電気的に接続されている。端子部８０は、金属部１０の第２面Ｆ２−１０に接触する第３面Ｆ３−８０と、第３面Ｆ３−８０と反対側にある第４面Ｆ４−８０と、第３面Ｆ３−８０と第４面Ｆ４−８０との間にある側面Ｆ８０Ｓとを有する。樹脂７０は、金属部１０の第２面Ｆ２−１０および端子部８０の側面Ｆ８０Ｓ上に設ける。【選択図】図３