TITANIUM COPPER FOR ELECTRONIC COMPONENT

• Main Author: HORIE HIROYASU
• Format: Patent
• Language: English; Japanese
• Published: 12.08.2016
• Subjects: ALLOYS; BASIC ELECTRIC ELEMENTS; CABLES; CHEMISTRY; CONDUCTORS; ELECTRICITY; FERROUS OR NON-FERROUS ALLOYS; INSULATORS; METALLURGY; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES; TREATMENT OF ALLOYS OR NON-FERROUS METALS

PROBLEM TO BE SOLVED: To provide an excellent balance of strength and ductility to a titanium copper by controlling a grain boundary reaction phase.SOLUTION: There is provided titanium copper for electronic component containing Ti of 2.0 to 4.0 mass%, one or more kind selected from a group consisting of Fe, Co, Mg, Si, Ni, Cr, Zr, Mo, V, Nb, Mn, B, and P as a third element of total 0 to 0.5 mass%, and the balance copper with inevitable impurities and having percentage of length of a grain boundary reaction phase occupying a grain boundary to the total grain boundary length of 5 to 40% in a structure observation of a cross section parallel to a rolling direction and average value of aspect ratio of the grain boundary reaction phase represented by b/a of 0.1 to 0.8, where a is length along with the grain boundary for each grain boundary reaction phase and b is length in a direction into a grain.SELECTED DRAWING: Figure 1 【課題】粒界反応相の制御によってチタン銅に対する強度と延性の優れたバランスを得る。【解決手段】Ｔｉを２．０〜４．０質量％含有し、第三元素としてＦｅ、Ｃｏ、Ｍｇ、Ｓｉ、Ｎｉ、Ｃｒ、Ｚｒ、Ｍｏ、Ｖ、Ｎｂ、Ｍｎ、Ｂ、及びＰからなる群から選択された１種以上を合計で０〜０．５質量％含有し、残部が銅及び不可避的不純物からなる電子部品用チタン銅であって、圧延方向に平行な断面の組織観察において、全粒界長さに対して粒界反応相が粒界を占める長さの割合が５〜４０％であり、且つ、個々の粒界反応相について粒界に沿った長さをａとし、粒内方向への長さをｂとして、ｂ／ａで表される粒界反応相のアスペクト比の平均値が０．１〜０．８であるチタン銅。【選択図】図１