CYLINDRICAL MOLD, DRY ETCHING DEVICE AND MANUFACTURING METHOD OF CYLINDRICAL MOLD

• Main Authors: MAEDA MASATOSHI, MITAMURA TETSUTOSHI
• Format: Patent
• Language: English; Japanese
• Published: 12.08.2016
• Subjects: AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; APPARATUS SPECIALLY ADAPTED THEREFOR; BASIC ELECTRIC ELEMENTS; CINEMATOGRAPHY; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROGRAPHY; HOLOGRAPHY; MATERIALS THEREFOR; ORIGINALS THEREFOR; PERFORMING OPERATIONS; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; SEMICONDUCTOR DEVICES; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

PROBLEM TO BE SOLVED: To provide a cylindrical mold having a large area and uniform fine uneven pattern, a dry etching device for manufacturing the same and a manufacturing method of the cylindrical mold.SOLUTION: A cylindrical mold (10) has a cylindrical substrate with an almost cylindrical shape (11) and a fine uneven pattern (20) formed on an outer peripheral surface of the cylindrical substrate (11) by a dry etching treatment, and both of opening diameter of a plurality of recess (21) of the fine uneven pattern (20) and a distribution of depth A(±%) satisfy the following formula (1). Formula (1) Distribution A(±%)≤maximum length α×β, where a maximum length α is a larger value of a maximum circumference length and a face length of the cylindrical substrate and β satisfies 0.01≤β≤0.02.SELECTED DRAWING: Figure 2 【課題】大面積かつ均一な微細凹凸パターンを持つ円筒形モールド、それを製造するためのドライエッチング装置及び円筒形モールドの製造方法を提供すること。【解決手段】円筒形モールド（１０）は、略円筒形状の円筒基材（１１）と、円筒基材（１１）の外周面上にドライエッチング処理により形成された微細凹凸パターン（２０）と、を具備し、微細凹凸パターン（２０）が備える複数の凹部（２１）の開口径及び深さの分布Ａ（±％）がいずれも下記式（１）を満たす。式（１）分布Ａ（±％）≦最大長α×β（最大長αとは、円筒基材の最大円周長及び面長のいずれか大きい値である。βは、０．０１≦β≦０．０２を満たす）【選択図】図２