MANUFACTURING METHOD OF PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE INCLUDING PRINTED CIRCUIT BOARD MANUFACTURED BY USING THE SAME

• Main Authors: NAKATSUKA TETSUYA, KATO YUKIKO, USHIFUSA NOBUYUKI, KASHIMURA TAKASHI
• Format: Patent
• Language: English; Japanese
• Published: 08.08.2016
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

PROBLEM TO BE SOLVED: To solve a problem that surface mounting components and insertion mounting components are mounted in different steps when both of the surface mounting components and the insertion mounting components are mounted on a printed circuit board.SOLUTION: A manufacturing method of a printed circuit board includes: a step where a metal mask, in which openings are disposed at positions corresponding to lands and through holes formed on a printed circuit board, is placed on the printed circuit board; and a step where a solder paste is applied to surfaces of the lands and inner parts of the through holes through the openings.SELECTED DRAWING: Figure 1 【課題】プリント回路基板に表面実装部品と挿入実装部品を混載する場合、表面実装部品と挿入実装部品を別々の工程で実装する必要がある。【解決手段】プリント回路基板上に形成されたランドとスルーホールの対応位置に開口を配置したメタルマスクを、前記プリント回路基板上に載置する工程と、前記開口を通じて、前記ランドの表面と前記スルーホールの内部とに、はんだペーストをに塗布する工程と、を有するプリント回路基板の製造方法。【選択図】図１