HEAT COLLECTION STRUCTURE AND HEAT COLLECTION PANEL
PROBLEM TO BE SOLVED: To provide a heat collection structure and a heat collection panel capable of improving a heat conduction efficiency between a heat collection plate and a heat collection pipe.SOLUTION: A heat collection structure 10 comprises: a heat collection pipe 12 passing heat medium; and...
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Main Authors | , , |
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Format | Patent |
Language | English Japanese |
Published |
08.08.2016
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Subjects | |
Online Access | Get full text |
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Summary: | PROBLEM TO BE SOLVED: To provide a heat collection structure and a heat collection panel capable of improving a heat conduction efficiency between a heat collection plate and a heat collection pipe.SOLUTION: A heat collection structure 10 comprises: a heat collection pipe 12 passing heat medium; and a first heat collection plate 21 and a second heat collection plate 22 including each of fixing parts 21b, 22b fixed to a fixing surface 50a of a supporting member 50, and connection parts 21a, 22a for connecting the fixing parts 21b, 22b with the heat collection pipe 12. The fixing part 21b of the first heat collection plate 21 and the fixing part 22b of the second heat collection plate 22 are arranged at positions where the heat collection pipe 12 is held in a direction crossing with an extending direction of the heat collection pipe 12, the first connecting location 25 where the connection part 21a of the first heat collection plate 21 is connected to the heat collection pipe 12 and the second connecting location 26 where the connection part 22a of the second heat collection plate 22 is connected to the heat collection pipe 12 are spaced apart.SELECTED DRAWING: Figure 6
【課題】集熱板と集熱管との熱伝導効率を向上させることが可能な集熱構造体および集熱パネルを提供することを目的とする。【解決手段】集熱構造体10は、熱媒体を通す集熱管12と、支持部材50の固定面50aに固定される固定部21b、22bと、固定部21b、22bと集熱管12とを接続する接続部21a、22aとをそれぞれ備える第1の集熱板21および第2の集熱板22を有し、第1の集熱板21の固定部21bと、第2の集熱板22の固定部22bとは、集熱管12の延出方向と交差する方向において集熱管12を挟む位置に配置されており、第1の集熱板21の接続部21aが集熱管12に接続される第1の接続箇所25と、第2の集熱板22の接続部22aが集熱管12に接続される第2の接続箇所26とが離間する。【選択図】図6 |
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Bibliography: | Application Number: JP20150019749 |