COPOLYMERIZED POLYIMIDE PRECURSOR AND COPOLYMERIZED POLYIMIDE

PROBLEM TO BE SOLVED: To provide a copolymerized polyimide which allows a stable copolymerized polyimide precursor to be produced under a mild condition, has excellent transparency, high heat resistance, a high glass transition temperature, and a low thermal linear expansion coefficient, and also sh...

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Main Authors TAKAZAWA RYOICHI, OKA TAKUYA, NAKAYAMA TOMONORI, KOHAMA YUKINORI, NAKAGAWA YOSHIHARU, NAKAYAMA TAKENARI
Format Patent
LanguageEnglish
Japanese
Published 04.08.2016
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Summary:PROBLEM TO BE SOLVED: To provide a copolymerized polyimide which allows a stable copolymerized polyimide precursor to be produced under a mild condition, has excellent transparency, high heat resistance, a high glass transition temperature, and a low thermal linear expansion coefficient, and also shows bent resistance.SOLUTION: The present invention provides a copolymerized polyimide precursor comprising a unit structure represented by general formula (1), and a specific unit structure [R1 is H or a C1-4 alkyl group; R2 and R3 independently represent H, a C1-6 alkyl group or a C3-9 alkylsilyl group].SELECTED DRAWING: None 【課題】温和な条件で安定した共重合ポリイミド前駆体の製造可能であり、さらに優れた透明性、高耐熱性、高いガラス転移温度、及び低熱線膨張係数を有するとともに、折り曲げ耐性をも両立して有する共重合ポリイミドを提供する。【解決手段】一般式(1)で表される単位構造と、特定の単位構造とを有する共重合ポリイミド前駆体。〔R1はH又はC1〜4のアルキル基;R2、R3はいずれも独立に、H、C1〜6のアルキル基又はC3〜9のアルキルシリル基〕【選択図】なし
Bibliography:Application Number: JP20160042210