PROCESSING METHOD AND PROCESSING DEVICE

• Main Authors: HIRAKAWA BUNICHI, NAKAGAWA MASAHITO, KUNO ATSUSHI, SATSUMA TAKESHI, OGAKI KENJI
• Format: Patent
• Language: English; Japanese
• Published: 04.08.2016
• Subjects: DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; PERFORMING OPERATIONS; POLISHING; TRANSPORTING

PROBLEM TO BE SOLVED: To provide a processing device and a processing method capable of improving a processing efficiency for processing a workpiece having an outer peripheral surface along a circular cone.SOLUTION: A processing method for processing an outer peripheral surface 8 of a tapered roller 7 comprises: in a state that the tapered roller 7 is rotated with its outer peripheral surface 8 in contact with a grind stone 11, the grind stone 11 is vibrated in a direction parallel to a generatrix of the outer peripheral surface 8 along the outer peripheral surface 8. Furthermore, the grinding stone 11 is vibrated, while a travel speed of the grind stone 11 traveling in the vibration direction along a larger diameter outer peripheral surface side of the tapered roller 7, is set to be lower than a travel speed of the grind stone 11 traveling in the vibration direction along a smaller diameter outer peripheral surface side.SELECTED DRAWING: Figure 1 【課題】円錐に沿った外周面を有するワークの加工に関して、加工効率を向上させる。【解決手段】円すいころ７の外周面８を加工するために、円すいころ７を回転させ、外周面８に対して砥石１１を接触させた状態で、この砥石１１を外周面８に沿って外周面８の母線に平行な方向に振動させる。そして、円すいころ７の内の、径が大きい大径外周面側に沿って砥石１１が振動方向に移動する際の移動速度を、径が小さい小径外周面側に沿って砥石１１が振動方向に移動する際の移動速度よりも低くして、砥石１１を振動させる。【選択図】 図１