SEMICONDUCTOR DEVICE

• Main Authors: UEDA KENJI, OKUMURA TOMOMI, FUKUTANI KEITA, IWASAKI SHINGO, HIRANO TAKAHIRO, NISHIHATA MASAYOSHI
• Format: Patent
• Language: English; Japanese
• Published: 28.07.2016
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a technology for suppressing peeling of a resin from a metal plate.SOLUTION: A semiconductor device to be provided includes a first metal plate, a semiconductor chip stacked on the first metal plate, a second metal plate stacked on the semiconductor chip, and a resin which seals an upper surface and a side surface of the first metal plate, the semiconductor chip, and a lower surface and a side surface of the second metal plate. The side surface of the first metal plate includes a lower part side surface positioned near the lower surface of the first metal plate and a protruding part which is arranged on the upper side of the lower part side surface to protrude from the lower part side surface. The protruding part is formed over the entire periphery of the first metal plate when viewed along a thickness direction of the first metal plate. A compression stress that is applied to the lower surface of the protruding part from the resin is larger than a shear stress that is applied to the lower part side surface from the resin.SELECTED DRAWING: Figure 1 【課題】 金属板からの樹脂の剥離を抑制する技術を提供する。【解決手段】 提供される半導体装置は、第１金属板と、前記第１金属板上に積層されている半導体チップと、前記半導体チップ上に積層されている第２金属板と、前記第１金属板の上面と側面、前記半導体チップ、及び、前記第２金属板の下面と側面を封止する樹脂を有している。前記第１金属板の側面が、前記第１金属板の下面近傍に位置する下部側面と、前記下部側面の上側に配置されているとともに前記下部側面から突出する凸部を有している。前記凸部が、前記第１金属板を厚み方向に沿って見たときに、前記第１金属板の全周に形成されている。前記樹脂から前記凸部の下面に加わる圧縮応力が、前記樹脂から前記下部側面に加わるせん断応力よりも大きい。【選択図】図１