SUBSTRATE AND SUBSTRATE MANUFACTURING METHOD

• Main Author: NISHIGUCHI KOHEI
• Format: Patent
• Language: English; Japanese
• Published: 28.07.2016
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a substrate which can be processed without harm by a semiconductor manufacturing apparatus using red light or infrared light for detecting existence of non-existence of a substrate, and to provide a manufacturing method for the same.SOLUTION: A substrate according to the present embodiment comprises: a substrate 10; a reaction layer 12 which is provided on a rear face of the substrate and in which metal for prevention of transmission which has lower transmissivity of red light or infrared light than that of the substrate and a material of the substrate are mixed; and a metal thin film layer 14, provided on a rear face of the reaction layer, made by a material the same with that of the metal for prevention of transmission.SELECTED DRAWING: Figure 1 【課題】本発明は、赤色光又は赤外光を基板の有無の検知に用いる半導体製造装置によって、弊害なく処理ができる基板、及びその基板の製造方法を提供することを目的とする。【解決手段】本願の発明に係る基板は、基板１０と、該基板の裏面に設けられた、赤色光又は赤外光の透過率が該基板より低い透過防止金属と該基板の材料とが混合した反応層１２と、該反応層の裏面に形成された、該透過防止金属と同じ材料の金属薄膜層１４と、を備えたことを特徴とする。【選択図】図１