MANUFACTURING METHOD FOR LEAD BUILT-IN CIRCUIT PACKAGE

PROBLEM TO BE SOLVED: To provide a method for cutting a lead in a desired length.SOLUTION: A dicing saw is made to run along dicing lines 100, 200 to dice, and thereby a lead 11 is cut in each predetermined length. Here, by changing the position of the dicing line 200, the length of the lead 11 can...

Full description

Saved in:
Bibliographic Details
Main Authors FUJII YOSHIO, MORI EISUKE
Format Patent
LanguageEnglish
Japanese
Published 28.07.2016
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:PROBLEM TO BE SOLVED: To provide a method for cutting a lead in a desired length.SOLUTION: A dicing saw is made to run along dicing lines 100, 200 to dice, and thereby a lead 11 is cut in each predetermined length. Here, by changing the position of the dicing line 200, the length of the lead 11 can arbitrarily be set. By this, the lead 11 for a circuit package is made to have an appropriate length so as to fit to the specification of the circuit package to be formed. At the cutting using a reference mark M as an alignment mark, it is possible to cut on the reference mark M or cut at a position apart from the reference mark M by a predetermined length.SELECTED DRAWING: Figure 4 【課題】所望の長さにリードを切断する方法を提供する。【解決手段】ダイシングライン１００、２００に沿ってダイシングソーを走行させ、個片化を行うことで、リード１１が所定の長さで切断される。ここで、ダイシングライン２００の位置を変えることにより、リード１１の長さを任意に設定することが可能となる。これにより、回路パッケージのリード１１を、形成する回路パッケージの仕様に合わせて適切な長さにする。基準マークＭをアライメントマークとして使用して切断する場合、基準マークＭ上を切断しても良いし、基準マークＭから所定の寸法だけ離れた位置で切断しても良い。【選択図】図４
Bibliography:Application Number: JP20150011160