WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

• Main Author: SUZUKI KUNIAKI
• Format: Patent
• Language: English; Japanese
• Published: 25.07.2016
• Subjects: APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PERFORMING OPERATIONS; PRINTED CIRCUITS; PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL; SPRAYING OR ATOMISING IN GENERAL; TRANSPORTING

PROBLEM TO BE SOLVED: To provide a wiring board capable of surely connecting a lower layer wiring and an upper layer wiring, and a method for manufacturing the same.SOLUTION: A wiring board 101 comprises a lower layer wiring 11 formed in a base material 19, a salient 54 provided on the lower layer wiring 11, an insulating layer 13 formed on the lower layer wiring 11, and an upper layer wiring 15 formed on the insulating layer 13. A method for manufacturing the wiring board 101 comprises: a first wiring step P1 of forming a lower layer wiring 11; a salient forming step P2 of forming a salient 54; an insulating layer step P3 of forming an insulating layer 13 including an opening 13k through which a part of the lower layer wiring 11 is exposed; and a second wiring step P4 of forming an upper layer wiring 15 on the insulating layer 13 and connecting the lower layer wiring 11 and the upper layer wiring 15 through the opening 13k. In the salient forming step P2, the salient 54 is formed in the position corresponding to the vicinity of an outer periphery 13g of the opening 13k.SELECTED DRAWING: Figure 3 【課題】下層配線と上層配線との接続が確実に行える配線基板及びその製造方法を提供することを目的とする。【解決手段】配線基板１０１は、基材１９に形成された下層配線１１と、下層配線１１上に設けられた凸部５４と、下層配線１１上に形成された絶縁層１３と、絶縁層１３上に形成された上層配線１５と、を備え、配線基板１０１の製造方法は、下層配線１１を形成する第１配線工程Ｐ１と、凸部５４を形成する凸形成工程Ｐ２と、下層配線１１の一部が露出する開口部１３ｋを有した絶縁層１３を形成する絶縁層工程Ｐ３と、絶縁層１３上に上層配線１５を形成し、開口部１３ｋで下層配線１１と上層配線１５を接続する第２配線工程Ｐ４と、を有し、凸形成工程Ｐ２では、開口部１３ｋの外周１３ｇ近傍に対応する位置に凸部５４を形成することを特徴としている。【選択図】図３