POLYIMIDE RESIN, RESIN COMPOSITION, AND ADHESIVE SHEET

• Main Authors: MASUDA KATSUYUKI, SATO KITARU, SHINADA EIITSU
• Format: Patent
• Language: English; Japanese
• Published: 25.07.2016
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CHEMISTRY; COMPOSITIONS BASED THEREON; DYES; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; POLISHES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF MATERIALS AS ADHESIVES

PROBLEM TO BE SOLVED: To provide a liquid polyimide resin excellent in processability and heat resistance.SOLUTION: A polyimide resin which is liquid at 25°C and has a maleimide group is obtained by reacting (A) a diamine represented by general formula (1), (B) a diamine represented by general formula (2) (except a diamine corresponding to (A) component) and (C) a polyamic acid obtained by reacting a tetracarboxylic acid dianhydride with (D) at least one selected from the group consisting of maleic anhydride and maleic anhydride derivatives. In the formula (1), n represents an integer of 1 to 70. In the formula (2), Rrepresents a divalent group.SELECTED DRAWING: None 【課題】加工性及び耐熱性に優れる液状のポリイミド樹脂を提供する。【解決手段】２５℃で液状であると共にマレイミド基を有するポリイミド樹脂であって、（Ａ）下記一般式（１）で表されるジアミン、（Ｂ）下記一般式（２）で表されるジアミン（但し、前記（Ａ）成分に該当するジアミンを除く）、及び、（Ｃ）テトラカルボン酸二無水物を反応させて得られるポリアミック酸と、（Ｄ）無水マレイン酸及び無水マレイン酸誘導体からなる群より選ばれる少なくとも一種と、を反応させて得られる、ポリイミド樹脂。［式（１）において、ｎは、１〜７０の整数を示す。］［式（２）において、Ｒ１は、２価の基を示す。］【選択図】なし