MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR MANUFACTURING DEVICE

PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor device capable of detecting or predicting in real time, scratch or crack during grinding; and to provide a semiconductor manufacturing device.SOLUTION: A manufacturing method of a semiconductor device in an embodiment has ste...

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Main Authors MATSUI YUKITERU, KAWASE AKIFUMI, SUZUKI SHUJI, MIKI TSUTOMU, KAWASAKI TAKAHIKO
Format Patent
LanguageEnglish
Japanese
Published 25.07.2016
Subjects
BASIC ELECTRIC ELEMENTS
DRESSING OR CONDITIONING OF ABRADING SURFACES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
SEMICONDUCTOR DEVICES
TRANSPORTING
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Summary:PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor device capable of detecting or predicting in real time, scratch or crack during grinding; and to provide a semiconductor manufacturing device.SOLUTION: A manufacturing method of a semiconductor device in an embodiment has steps of: detecting an elastic wave generated from a workpiece during grinding of the workpiece; and detecting or predicting an abnormality of the workpiece generated during grinding by analyzing the detected elastic wave.SELECTED DRAWING: Figure 1 【課題】研磨中のスクラッチまたはクラックをリアルタイムで検出しまたは予測することができる半導体装置の製造方法および半導体製造装置を提供する。【解決手段】一実施形態の半導体装置の製造方法は、被加工物の研磨中に前記被加工物から発生する弾性波を検出することと、検出された弾性波を解析して前記研磨中に発生する前記加工物の異常を検出しまたは予測することと、を持つ。【選択図】図１
Bibliography:Application Number: JP20150007017