VACUUM CIRCUIT BREAKER

PROBLEM TO BE SOLVED: To allow higher voltage of a vacuum circuit breaker.SOLUTION: A vacuum circuit breaker 1 comprises: a ground tank 2; vacuum interrupters 3, 4; a linkage mechanism 5 to open/close the vacuum interrupters 3, 4; and a linkage mechanism case 19 housing the linkage mechanism 5. A su...

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Bibliographic Details
Main Authors SUWA AKIHIRO, NAGATAKE KAZUHIRO
Format Patent
LanguageEnglish
Japanese
Published 11.07.2016
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Summary:PROBLEM TO BE SOLVED: To allow higher voltage of a vacuum circuit breaker.SOLUTION: A vacuum circuit breaker 1 comprises: a ground tank 2; vacuum interrupters 3, 4; a linkage mechanism 5 to open/close the vacuum interrupters 3, 4; and a linkage mechanism case 19 housing the linkage mechanism 5. A supporting porcelain tube 21 supporting the linkage mechanism case 19 is arranged on an inner peripheral surface of the ground tank 2, and an insulation operation rod 20 actuating the linkage mechanism 5 is inserted into the supporting porcelain tube 21 and a side part of the ground tank 2. An operation room 23 is arranged at an insertion part of the insulation operation rod 20 in the ground tank 2, and a conversion mechanism 24 actuating the insulation operation rod 20 is stored in the operation room 23. A rotation shaft 25 of the conversion mechanism 24 is exposed through a rotation seal part 26 outside of the operation room 23. 0.3 MPa or less of insulation gas is filled into a space (inside of the linkage mechanism case 19, inside of the supporting porcelain tube 21, or the like) communicating with an inner peripheral part of bellows 13, 13 of the vacuum interrupters 3, 4, and high pressure insulation gas is filled into the other space.SELECTED DRAWING: Figure 1 【課題】真空遮断器の高電圧化に貢献する。【解決手段】接地タンク2と、真空インタラプタ3,4と、真空インタラプタ3,4を開閉するリンク機構5と、リンク機構5を収納するリンク機構ケース19と、を有する真空遮断器1である。リンク機構ケース19を支持する支持碍管21を接地タンク2の内周面に設け、リンク機構5を動作させる絶縁操作棒20を支持碍管21内及び接地タンク2側部を挿通して設ける。接地タンク2の絶縁操作棒20挿通部に操作室23を設け、操作室23内に絶縁操作棒20を駆動する変換機構24を収納する。変換機構24の回転軸25を回転シール部26を介して操作室23の外部に露出させる。真空インタラプタ3,4のベローズ13,13内周部と連通した空間(リンク機構ケース19内や支持碍管21内等)に0.3MPa以下の絶縁ガスを充填し、その他の空間に高圧の絶縁ガスを充填する。【選択図】図1
Bibliography:Application Number: JP20150001239