SETTING DEVICE OF LASER PROCESSING APPARATUS, LASER PROCESSING APPARATUS HAVING SETTING DEVICE, AND SETTING PROGRAM OF LASER PROCESSING APPARATUS

• Main Authors: MIYATA KAZUYOSHI, HATAKEYAMA KOTA, KOMIYA TOMONORI, OBATA KENJI, SHIMAZAKI DAICHI, OKUNO TOMOYA, TAKAGI TAKASHI
• Format: Patent
• Language: English; Japanese
• Published: 11.07.2016
• Subjects: CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

PROBLEM TO BE SOLVED: To provide a setting device of a laser processing apparatus for enhancing a laser working quality, a laser processing apparatus having the setting device, and a setting program for the laser processing apparatus.SOLUTION: A setting device 60 comprises a control part 62 for adjusting the beam diameter and the focal length of a laser beam to be emitted from a magnification varying part 30 on the basis of a processing position or a position to be applied by a laser beam on the working face of a work-piece 100, thereby to adjust the spot diameter of the laser beam.SELECTED DRAWING: Figure 1 【課題】レーザ加工の品質が高められるレーザ加工装置の設定装置、これを備えるレーザ加工装置、および、レーザ加工装置の設定プログラムを提供する。【解決手段】設定装置６０は、ワーク１００の加工面におけるレーザ光が当てられる位置である加工位置に基づいて、倍率可変部３０から出射されるレーザ光のビーム径、および、レーザ光の焦点距離を調整することによりレーザ光のスポット径を調整する制御部６２を備える。【選択図】図１