LASER PROCESSING APPARATUS SETTER, LASER PROCESSING APPARATUS COMPRISING THE SAME, AND SETTING PROGRAM OF LASER PROCESSING APPARATUS

• Main Authors: WAKAKO KOICHI, OTA TAKAHIRO, KAWASHIMA YOSHIHIDE, NAKATSUKASA TOMOYUKI
• Format: Patent
• Language: English; Japanese
• Published: 11.07.2016
• Subjects: CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

PROBLEM TO BE SOLVED: To provide a laser processing apparatus setter capable of easily adjusting the power density of a laser beam, a laser processing apparatus comprising the same, and a setting program of the laser processing apparatus.SOLUTION: A setter 20 is used for a laser processing apparatus 1 comprising a laser beam emission unit 11 that emits laser beams and a scan unit 12 that scans a laser beam emitted from the laser beam emission unit 11 in two dimensions. The setter 20 comprises a plurality of operation units that adjust the power density of a laser beam that irradiates a workpiece 100 and a setting control unit 24 that, on the basis of one operation unit, adjusts the power density of a laser beam that irradiates a part corresponding to each of a plurality of coordinates included in a predetermined range in a coordinate plane which indicates a movable range of the scan unit 12.SELECTED DRAWING: Figure 1 【課題】レーザ光のパワー密度を容易に調節可能なレーザ加工装置の設定装置、これを備えるレーザ加工装置、および、レーザ加工装置の設定プログラムを提供する。【解決手段】設定装置２０は、レーザ光を出射するレーザ出射部１１、レーザ出射部１１により出射されたレーザ光を２次元に走査する走査部１２を備えるレーザ加工装置１に用いられる。設定装置２０は、ワーク１００に照射されるレーザ光のパワー密度を調節する複数の操作部、および、１つの操作部の操作に基づいて、走査部１２の可動範囲を示す座標平面における所定の範囲に含まれる複数の座標のそれぞれに対応する部分に照射されるレーザ光のパワー密度を調節する設定制御部２４を備える。【選択図】図１