RELEVANT SYSTEM, DEVICE AND METHOD INCLUDING POWER AMPLIFIER MODULE

• Main Authors: JENS ALBRECHT RIEGE, MATTHEW THOMAS OZALAS, ANTHONY JAMES LOBIANCO, SHAO HONGXIAO, PATRICK LAWRENCE WELCH, MATTHEW SEAN READ, SUN WEIMIN, SUN HSIANGIH, ZHANG GUOHAO, HOWARD E CHEN, SANDRA LOUISE PETTY-WEEKS, SHEN HONG, DINHPHUOC VU HOANG, HARDIK BHUPENDRA MODI, HOANG MONG NGUYEN, GUO YIFAN, MEHRAN JANANI, PHILIP JOHN LEHTOLA, DAVID STEVEN RIPLEY, KO TIN MYINT, PETER J ZAMPARDI JR
• Format: Patent
• Language: English; Japanese
• Published: 07.07.2016
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a power amplifier module for use in wireless communication.SOLUTION: A power amplifier module includes a power amplifier configured to supply an amplified RF signal by receiving a wireless frequency (RF) signal, and a wire bond pad 113 connected electrically with the power amplifier. The wire bond pad includes a nickel layer 127 having a thickness less than 0.5 μm, a palladium layer 128 on the nickel layer, and a gold layer 129 on the palladium layer. The power amplifier module further includes a conductive trace, including an upper surface having a plating part and a non-plating part surrounding the plating part, and the wire bond pad is arranged on the plating part.SELECTED DRAWING: Figure 4 【課題】無線通信において使用されるパワーアンプモジュールを提供する。【解決手段】パワーアンプモジュールは、無線周波数（ＲＦ）信号を受けて、増幅したＲＦ信号を供給するように構成されたパワーアンプと、パワーアンプに電気的に接続されたワイヤーボンドパッド113とを含み、ワイヤーボンドパッドは０．５μｍ未満の厚みを有するニッケル層127と、ニッケル層の上のパラジウム層128と、パラジウム層の上の金層129とを含む。パワーアンプモジュールは、さらに、導電トレースを含み、導電トレースはめっき部と、めっき部を囲む非めっき部とを有する上面部を含み、ワイヤーボンドパッドは、めっき部の上に配置される。【選択図】図４