TEMPERATURE MEASUREMENT MECHANISM AND THERMAL PROCESSOR

• Main Author: YAMAZAKI RYOJI
• Format: Patent
• Language: English; Japanese
• Published: 07.07.2016
• Subjects: BASIC ELECTRIC ELEMENTS; COLORIMETRY; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT,POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRA-RED,VISIBLE OR ULTRA-VIOLET LIGHT; MEASURING; MEASURING QUANTITY OF HEAT; MEASURING TEMPERATURE; PHYSICS; RADIATION PYROMETRY; SEMICONDUCTOR DEVICES; TESTING; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR

PROBLEM TO BE SOLVED: To measure the temperature of an entire substrate to be subjected which is a heating object by a thermal processor at one time.SOLUTION: The temperature measurement mechanism includes: an imaging unit 60 taking an image of a wafer W; a first filter between the wafer W and the imaging unit 60 through which light with a wavelength not larger than a first wavelength penetrates; a second filter between the wafer W and the imaging unit 60 through which light with a wavelength not smaller than a second wavelength penetrates; a storage unit 100 storing a correlation obtained in advance between the temperature of the wafer W and a pixel value of the image of the wafer taken by the imaging unit 60; and an operational unit 101 calculating the temperature of the wafer W being heated based on a pixel value extracted from an image of the wafer W being heated and the correlation F stored in the storage unit 100, the first wavelength being larger than the second wavelength.SELECTED DRAWING: Figure 1 【課題】熱処理装置において加熱対象となる被処理基板の温度を当該被処理基板の全面にわたって一度で測定する。【解決手段】温度測定機構は、ウェハＷを撮像する撮像部６０と、撮像部６０とウェハＷとの間に配置された、第１の波長と同じかまたはそれよりも短い波長の光を透過させる第１のフィルタと、撮像部６０とウェハＷとの間に配置された、第２の波長と同じかまたはそれよりも長い波長の光を透過させる第２のフィルタと、予め求められた、ウェハＷの温度と、撮像部６０で撮像したウェハの撮像画像の画素値との相関関係を記憶する記憶部１００と、加熱処理中のウェハＷの撮像画像から抽出された画素値と、記憶部１００に記憶された相関関係Ｆに基づいて、加熱処理中のウェハＷの温度を算出する演算部１０１と、を有し、第１の波長は、前記第２の波長よりも長い波長である。【選択図】図１