LED LAMP

PROBLEM TO BE SOLVED: To facilitate a step of assembling a heat sink and an LED substrate, in a bulb type LED lamp.SOLUTION: A bulb type LED lamp has a mouthpiece, an LED substrate mounted with an LED element, a heat sink mounted on the LED substrate. In the LED lamp, the heat sink and the end part...

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Bibliographic Details
Main Authors IMANARI TAKAYOSHI, IWASAKI KIYOTERU, KOBAYASHI YUTA
Format Patent
LanguageEnglish
Japanese
Published 23.06.2016
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Summary:PROBLEM TO BE SOLVED: To facilitate a step of assembling a heat sink and an LED substrate, in a bulb type LED lamp.SOLUTION: A bulb type LED lamp has a mouthpiece, an LED substrate mounted with an LED element, a heat sink mounted on the LED substrate. In the LED lamp, the heat sink and the end part of the LED substrate may be fixed with a clip, and the heat sink may be formed by folding a sheet of plate-like member.SELECTED DRAWING: Figure 5 【課題】電球型のLEDランプにおいて、ヒートシンクとLED基板を組み立てる工程を容易化する。【解決手段】口金と、LED素子が実装されたLED基板と、前記LED基板に装着されヒートシンクと、を有する電球型のLEDランプにおいて、前記ヒートシンクと前記LED基板の端部はクリップに挟まれて固定されている、としてよい。前記LEDランプにおいて、前記ヒートシンクは1枚の板状部材を折り曲げることによって形成されている、としてよい。【選択図】 図5
Bibliography:Application Number: JP20140256031