CONDUCTIVE PATTERN-FORMING SHEET, AND METHOD OF MANUFACTURING THE SAME

PROBLEM TO BE SOLVED: To provide a method of easily manufacturing a conductive pattern-forming sheet less likely to cause conductive defects of a conductive pattern composed of a copper vapor-deposited film, and capable of reducing a percent defective.SOLUTION: The method of manufacturing a conducti...

Full description

Saved in:
Bibliographic Details
Main Authors NISHIZAWA KOJI, MIYAJIMA KENTARO
Format Patent
LanguageEnglish
Japanese
Published 23.06.2016
Subjects
Online AccessGet full text

Cover

Loading…
More Information
Summary:PROBLEM TO BE SOLVED: To provide a method of easily manufacturing a conductive pattern-forming sheet less likely to cause conductive defects of a conductive pattern composed of a copper vapor-deposited film, and capable of reducing a percent defective.SOLUTION: The method of manufacturing a conductive pattern-forming sheet 1 includes: a coating process of forming a coated layer 30 containing a carbon material and a binder resin so as to coat a copper vapor-deposited sheet formed with the copper vapor-deposited film on one surface of a substrate 10 with the copper vapor-deposited film; and a conductive pattern-forming process of etching the coated layer 30 and the copper vapor-deposited film by irradiating the coated layer 30 with laser beams into a pattern shape to form a conductive pattern 20.SELECTED DRAWING: Figure 1 【課題】銅蒸着膜からなる導電パターンの導電不良が生じにくく、不良率を小さくできる導電パターン形成シートを容易に製造できる製造方法を提供する。【解決手段】本発明の導電パターン形成シート1の製造方法は、基材10の一方の面に銅蒸着膜を形成した銅蒸着シートに、前記銅蒸着膜が被覆されるように、炭素材料及びバインダ樹脂を含有する被覆層30を形成する被覆工程と、被覆層30にレーザ光をパターン状に照射して被覆層30及び銅蒸着膜をエッチングして導電パターン20を形成する導電パターン形成工程とを有する。【選択図】図1
Bibliography:Application Number: JP20140252962