SPUTTERING TARGET, Ag ALLOY FILM AND CONDUCTIVE FILM

• Main Authors: IINO MINORU, KAWAGUCHI YUKIO, KIUCHI KENICHI
• Format: Patent
• Language: English; Japanese
• Published: 23.06.2016
• Subjects: ALLOYS; BASIC ELECTRIC ELEMENTS; CABLES; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; CONDUCTORS; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRICITY; FERROUS OR NON-FERROUS ALLOYS; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; INSULATORS; METALLURGY; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; TREATMENT OF ALLOYS OR NON-FERROUS METALS

PROBLEM TO BE SOLVED: To provide a sputtering target capable of forming a silver based thin film achieving both of excellent corrosion resistance of an Ag alloy film used for a laminated transparent conductor and high light transmittance and excellent conductivity of the laminated transparent conductor.SOLUTION: The sputtering target includes 0.5-1.5 at% of Nb, 0.5-1.5 at% of at least one element selected from Pt and Pd and 90 at% or more of Ag as the remainder, and the total content of Nb, Pt and Pd is 1.0-2.5 at%.SELECTED DRAWING: None 【課題】積層型透明導電体に使用されるＡｇ合金膜の優れた耐食性と、積層型透明導電体における光線透過率の高さ、及び、導電性の良さの両立を可能にする銀系薄膜を形成可能なスパッタリングターゲットを提供する。【解決手段】このスパッタリングターゲットは、Ｎｂを０．５〜１．５ａｔ％、Ｐｔ及びＰｄから選ばれた少なくとも１種類の元素を０．５〜１．５ａｔ％、及び、Ａｇを残部９０ａｔ％以上含み、Ｎｂ、Ｐｔ、及び、Ｐｄの含有率の総和が１．０〜２．５ａｔ％である。【選択図】なし