METHOD OF MANUFACTURING ORGANIC EL DISPLAY PANEL AND MASK FOR USE THEREIN

PROBLEM TO BE SOLVED: To avoid such a case that a multilayer wiring layer is crushed locally by an undesired protrusion of a mask.SOLUTION: A mask 190 includes a planar member 191, and a buffer member 192 composed of a resin material and attached to the planar member 191 by hot press. The planar mem...

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Bibliographic Details
Main Authors TAKIGUCHI AKIRA, KAMIYA KAZUO
Format Patent
LanguageEnglish
Japanese
Published 20.06.2016
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC HEATING
ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To avoid such a case that a multilayer wiring layer is crushed locally by an undesired protrusion of a mask.SOLUTION: A mask 190 includes a planar member 191, and a buffer member 192 composed of a resin material and attached to the planar member 191 by hot press. The planar member 191 covers a second portion 122 of a multilayer wiring layer 120 entirely or partially. The buffer member 192 comes into contact with a panel intermediate product 100X, when the mask 190 is applied thereto.SELECTED DRAWING: Figure 7 【課題】 多層配線層がマスクの不所望の突起により局所的に押し潰されることを回避する。【解決手段】マスク１９０は、板状部材１９１と、樹脂材料からなり板状部材１９１に熱圧着により取り付けられた緩衝部材１９２とを備える。板状部材１９１は、多層配線層１２０の第２部分１２２を全体的または部分的に被覆する。緩衝部材１９２は、マスク１９０がパネル中間品１００Ｘにあてがわれた際にパネル中間品１００Ｘに接触する。【選択図】図７
Bibliography:Application Number: JP20140248652